SAN JOSE, CA, October 3, 2022 — Samsung Electronics, a global leader in advanced semiconductor technology, today announced a strengthened business strategy for its foundry business with the introduction of cutting-edge technologies at the annual Samsung Foundry Forum event.
- Samsung aims to mass produce 2nm technology by 2025 and 1.4nm by 2027.
- Samsung plans to expand its production capacity for advanced nodes by more than 3 times by 2027
- Non-mobile applications, including HPC and automotive, are expected to exceed 50% of the foundry portfolio by 2027.
- Samsung Foundry is strengthening its customer service capabilities in its partner ecosystem
With significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, the demand for advanced semiconductors has increased dramatically, making innovation in semiconductor process technology critical to the business success of foundry customers . To that end, Samsung has highlighted its commitment to bring its most advanced process technology, 1.4-nanometer (nm), to mass production in 2027.
During the event, Samsung also outlined the steps its foundry business is taking to meet customer needs, including: △technological innovation in the foundry process, △optimization of process technology for each specific application, △robust manufacturing capabilities and △ personalized customer service.
“The goal of technology development to 1.4n and foundry platforms specialized for each application, together with stable supply through consistent investment, are part of Samsung’s strategies to ensure customer confidence and support their success,” said Dr. Si- young Choi, president and head of foundry business at Samsung Electronics. “Aware of each customer’s innovation with our partners is at the core of our foundry service.”
Unveiling Samsung’s Advanced Nodes Roadmap to 1.4nm in 2027
With the company’s success in bringing the latest 3nm technology to mass production, Samsung will further improve the gate-all-around (GAA)-based technology and plans to introduce a 2nm process in 2025 and a 1.4nm process in 2027 .
While pioneering process technology, Samsung is also accelerating the development of 2.5D/3D heterogeneous integrated packaging technology to provide a complete system solution in foundry services.
Through continuous innovation, its 3D X-Cube package with micro-bump interconnect will be ready for mass production in 2024, and the bump-free X-Cube will be available in 2026.
The share of HPC, automotive and 5G will be more than 50% by 2027.
Samsung is actively planning to target high-performance, low-power semiconductor markets such as HPC, automotive, 5G, and the Internet of Things (IoT).
To better meet customer needs, custom and custom process assemblies were introduced at this year’s Foundry Forum. Samsung will improve support for the GAA-based 3nm process for HPC and mobile devices, while further diversifying the 4nm process specialized for HPC and automotive applications.
Specifically for automotive customers, Samsung currently provides embedded non-volatile memory (eNVM) solutions based on 28nm technology. To maintain automotive-grade reliability, the company plans to further expand process nodes by launching 14nm eNVM solutions in 2024 and adding 8nm eNVM in the future. Samsung is mass producing 8nm RF after 14nm RF, and 5nm RF is currently in development.
“Shell-First” operational strategy to respond promptly to customer needs
Samsung plans to expand its production capacity for advanced nodes by more than three times by 2027 compared to this year.
Including the new factory under construction in Taylor, Texas, Samsung’s foundry production lines are currently in five locations: Giheung, Hwaseong and Pyeongtaek in Korea; and Austin and Taylor in the United States.
At the event, Samsung detailed its “Shell-First” strategy for capacity investment, building cleanrooms first regardless of market conditions. With clean rooms readily available, factory equipment can be installed later and flexibly adjusted as needed in line with future demand. Through the new investment strategy, Samsung will be able to better meet the demands of customers.
Investment plans in a new “Shell-First” production line in Taylor, following on from the first line announced last year, were also unveiled, as well as a potential expansion of Samsung’s global semiconductor manufacturing network.
Expanding the SAFE ecosystem to strengthen personalized services
Following the ‘Samsung Foundry Forum’, Samsung will hold the ‘SAFE Forum’ (Samsung Advanced Foundry Ecosystem) on October 4. New foundry technologies and strategies will be introduced with ecosystem partners spanning areas such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and Test (OSAT), Design Solution Partner (DSP) and Cloud.
In addition to 70 partner presentations, Samsung Design Platform team leaders will present the ability to apply Samsung processes such as co-optimizing design technologies for GAA and 2.5D/3DIC.
As of 2022, Samsung provides more than 4,000 IP with 56 partners and also cooperates with nine and 22 partners in design solution and EDA, respectively. It also offers cloud services with nine partners and bundling services with 10 partners.
Together with its ecosystem partners, Samsung provides integrated services that support solutions from IC design to 2.5D/3D packages.
Through its robust SAFE ecosystem, Samsung plans to identify new fabless customers by strengthening customized services with improved performance, fast delivery and price competitiveness, while actively attracting new customers such as hyperscalers and startups.
Starting in the United States (San Jose) on October 3, the Samsung Foundry Forum will be held consecutively in Europe (Munich, Germany) on the 7th, Japan (Tokyo) on the 18th, and Korea (Seoul) on the 20th, through which the introduction of customized solutions for each region. A recording of the event will be available online from the 21st for those unable to attend in person.
About Samsung Electronics Co., Ltd.
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Source: Samsung Electronics Co., Ltd.